IPC Training and Certification

About IPC Training & Certification

IPC — Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. QSG, founded in 1993 and our partner organization, the Advanced Soldering Institute, are a Worldwide Approved IPC Training Center, providing all current IPC Certifications. We are one of the few IPC Training Centers in the United States and our specialty is quality instruction of IPC 600, 610, 620, 7711/7721, and complete J-STD and Space Addendum!  Successful students receive manuals, instruction, and certification from a Master IPC Trainer in these circuit card manufacturing and repair standards recognized worldwide as the leading industry Standards.

The IPC industry-developed and approved programs use the two-tier “train the trainer” approach for standardized classroom training to assure understanding of IPC criteria in the industry’s most popular IPC documents. This IPC training leads to an industry traceable IPC certification for the instructors, standards experts, quality team, management and operators. Periodic IPC re-certification is required, and IPC course materials are updated for each IPC document revision with support from the same industry experts who contributed to the IPC standard.

Why pursue IPC Certification?

• Demonstrate to current and potential customers that your company considers rigorous quality control practices very important.
• Meet the requirements of OEMs and electronics manufacturing companies that expect their suppliers to have these important IPC credentials.
• Gain valuable industry recognition for your company and yourself.
• Facilitate quality assurance initiatives that have become important in international trading.

Choose from the following 6 topics:

IPC-A-610H – Lecture based training on Acceptability of Electronics Assemblies

Topics include- Purpose and application of IPC-A-610; Hardware installation; Soldering criteria, including lead free connections; Soldering requirements for connecting to terminals; Soldering connection requirements for plated-through holes; Surface mounting criteria for chip components, leadless and leaded chip carriers; Jumper wire assembly requirements; Criteria for component damage, laminate conditions, cleaning and coating

J-STD-001H – Lecture and hands-on skills-based training on Requirements for Soldered Electrical and Electronics Assemblies

Topics include- General requirements such as safety, tools, and electrostatic discharge (ESD); Wire and terminal assembly requirements, demonstration and laboratory; Through hole technology requirements, demonstration and laboratory; Surface mount technology requirements, demonstration and laboratory; General soldered connection acceptance requirements including lead free; Inspection methodologies, demonstration and laboratory

J-STD-001GS – Revision HS will be available as soon as IPC releases the training material.

Lecture based Space Addendum to the J-STD is also available as a 4-hour additional module to the basic course. 

IPC/WHMA-A-620D – Lecture based training on Requirements and Acceptance of Cable and Wire Harness Assemblies

Topics include- Cable and wire dimensioning, tolerances and preparation; Crimp terminations- stamped and formed contacts; Machined contacts; Insulation displacement connections; Ultrasonic welding; Soldered terminations; Splices; Connectorization; Molding and potting; Marking and labeling; Co-ax and twin-ax assembly; Wire bundle securing; Shielding; Installation; Wire wrap (solderless); Testing of Cable/Wire harness assemblies

Hands on instruction using your equipment is also available as a hands-on optional module.

IPC-7711 &-7721 – Lecture and hands-on skills-based training on Rework, Repair and Modification of Electronics Assemblies

Topics include- Product classification, skill levels, tools and materials; Basic surface mount and through-hole component removal; Land preparation and component installation; Primary heating methods: conductive, convective, etc.; Handling electronics assemblies; Wire splicing techniques; Through hole component removal and installation; Chip and MELF rework procedures; SOIC/SOT, J-lead, and QFP rework; Printed wiring board circuit and laminate repair; Conformal coating removal

IPC-A-600K – Lecture based training and labs on Acceptability of Printed Circuit Boards

Topics include- Printed board product classifications and acceptance criteria; Base material surface and subsurface conditions such as measling/crazing; Solder resist coverage over conductors and registration to lands; Conductor width, spacing and annular ring requirements; Dielectric material criteria for etchback, voids, and resin recession; Plated through-hole requirements for copper plating thickness, voids, nodules and cracks; Acceptance criteria for flexible, rigid-flex and metal core printed boards.

Please contact Angelo Scangas (USA 978-430-7611) to discuss your Solder training needs and to obtain a no obligation proposal.